Sputtering target
Compatible with various types of target materials using different manufacturing methods! Backing plates can also be produced.
The sputtering method accelerates ionized molecules and atoms to collide with a material, depositing the ejected material as a thin film on a substrate, and this material is called the target. The shape of the target is determined by the device, and it can be rectangular, cylindrical, etc. Generally, bonding-type targets with the material attached to a backing plate are used, but particularly for cylindrical targets, there are also bonding types, thermal spray types, and monolithic types. We provide suitable types for each target material. [Shapes (Manufacturing Methods)] ■ Cylindrical (Bonding) ■ Cylindrical (Monolithic) ■ Cylindrical (Thermal Spray) ■ Flat (Bonding) *For more details, please refer to the PDF document or feel free to contact us.
- Company：ソルテック
- Price：Other
